fly-801 t top led wire bonder
features
- thermosonic high speed bonding, fast conversion
- vision system: programmable look ahead pr
- multiple die and level bonding capability
- ease of maintenance
- competitive pricing
wire type
au, ag, cu, cupd, alloy
application
led industry
item | parameter |
bonding technology | thermosonic bonding |
optics | single path |
bonding accuracy | ±3.0μm |
bond area | 56 x 70mm |
cycle time | 65ms/wire |
wire diameter | 18μm-50μm |
service hotline
400-889-8833
400-889-8833
sale@kejiegroup.com