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fly-801 t top led wire bonder

featuresparameters

features

- thermosonic high speed bonding, fast conversion

- vision system: programmable look ahead pr

- multiple die and level bonding capability

- ease of maintenance

- competitive pricing

 

wire type

au, ag, cu, cupd, alloy


application

led industry


item

parameter

bonding   technology

thermosonic   bonding

optics

single path

bonding accuracy

±3.0μm

bond area

56 x 70mm

cycle time

65ms/wire

wire diameter

18μm-50μm


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