广东科杰技术股份有限公司、广东佳铁、雕铣机、精雕机、钻铣中心-pg电子娱乐平台

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400-889-8833

fly-801 to laser diode wire bonder

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featuresparameters

features

- thermosonic high speed bonding, fast conversion

- vision system: programmable look ahead pr

- multiple die and level bonding capability

- rotating platform

- bonding on crossed planes at any angle

wire type

applied range

optical communications

item	parameter
bonding technology	thermosonic bonding
optics	single path or double paths (optional)
bonding accuracy	±3.0μm
bonding area	56 x 70mm
cycle time	parallel planes: 60ms/wire crossed planes: 80ms/wire
wire diameter	17μm-50μm

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about us: company profile; milestones; corporate culture; honors; videos; structure; jiatie news

products: cnc system series; jiatie series; kejie series; optional accessories

application fields: 3c product; precision mould; precision electrode; artware; hard-cutting material; auto part; multi-axis machining; medical device

customer service: service policy; service guide; service network; customer feedback; information download; faq

contact us: contact information; recruitment; online message

service hotline

400-889-8833

links

400-889-8833

sale@kejiegroup.com